Optical and thermal properties of flip-chip LED bulbs using chip-scale package
نویسندگان
چکیده
منابع مشابه
Design for Flip-Chip and Chip-Size Package Technology
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologies. This movement is occurring at all levels: at the IC, at the IC package, at the module, at the hybrid, the PC board which ties all the systems together. Interconnection density and methodology becomes ...
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Thermal interface materials (TIM) are studied to identify its design criterion in a flip chip PBGA applications at different power dissipation levels. As there are continuous interests in proper selection of TIM material and design, the thermal performance analysis can offer design guidance for packaging engineers. Computational techniques are used with both computational fluid dynamics softwar...
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Thermo-mechanical reliability of the solder bumped flip chip packages having underfill encapsulant was evaluated with thermal shock testing. In the initial reaction, the reaction product between the solder and Cu mini bump of chip side was Cu6Sn5 IMC layer, while the two phases which were (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 were formed between the solder and electroless Ni-P layer of the package side. ...
متن کاملImproving Heat Transfer from a Flip-Chip Package
The lid of an ASIC package can significantly increase the temperature of the die by impeding heat transfer. In flip-chip packages the backside of a die can be exposed by eliminating the lid, thus allowing a heat sink to be attached directly. Numerical finite difference methods and experimentation were used to investigate the differences between lidded and lidless flip-chip designs. The results ...
متن کاملStacked-chip-scale-package-design guidelines
You can configure the die stack for S-CSPs (stacked-die chip-scale packages) in multiple ways. However, using design guidelines can help you use die stacking for laminate-based and wire-bonded S-CSPs with more than 200 I/O pins. These packages typically find use in handheld products. When stacking mixed-technology dice, such as ASICs and memory, the challenge is often how to deal with wire-bond...
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ژورنال
عنوان ژورنال: Journal of Physics: Conference Series
سال: 2018
ISSN: 1742-6588,1742-6596
DOI: 10.1088/1742-6596/1074/1/012002